SST 1200

Model 1200 Table-Top Vacuum Solder Reflow Station
The SST Model 1200 Table-Top Vacuum Solder Reflow Station has been designed for process development and low volume production of flux-free and void-free soldered joints in microelectronic packages and components. A ramping temperature controller is combined with customized PLC's to provide automatic process control. Control of the processing atmosphere is integrated with the temperature controller through automatically actuated solenoid valves. A large viewing window in the cover provides invaluable assistance in determining the proper processing temperatures for solder reflow. The system includes a graphite resistive heating element and a flat hot plate for component placement
Specifications:

-Maximum Operating Temperature: 450 deg C
-Minimum Vacuum Level: 100 millitorr (0.13 millibar)
-Maximum Operating Pressure: 50 psig (4.5 bar)
-Heated Area: 5.0 x 4.0 in (125 x 100 mm)
-Recommended process area: 3.5 x 3.5 in (90 x 90 mm)
-Thermal uniformity process area: 5 deg C or better
-Maximum heating rate in vacuum: 4℃/sec
-Typical forced cooling rate: 2 deg C/sec
-Clearance over hot plate: 2 in (50 mm)
-Viewing window: 3.5 in (90 mm) diameter
-Size:(W x D x H): 30.5 x 25 x 19 in (78 x 64 x 48 cm)
Weight: 180 lb (80 kg)
-Electrical: 3.0 kW maximum, 50 or 60 Hz 110volt, 15 amp, single phase
-Vacuum: External pump required (not incluced)
-Process gasses: Nitrogen plus one optional at 75 psig (3.5 kg/cm2) (see formic acid option)
-Cooling Water (Optional): 1 gpm at 30 psig (4 lpm at 2 kg/cm^2)