SST 1200

Model 1200 Table-Top Vacuum Solder Reflow Station...The SST Model 1200 Table-Top Vacuum Solder Reflow Station has been designed for process development and low volume production of flux-free and void-free soldered joints in microelectronic packages and components. A ramping temperature controller is combined with customized PLC's to provide automatic process control. Control of the processing atmosphere is integrated with the temperature controller through automatically actuated solenoid valves. A large viewing window in the cover provides invaluable assistance in determining the proper processing temperatures for solder reflow. The system includes a graphite resistive heating element and a flat hot plate for...component placement.......Specifications:...-Maximum Operating Temperature: 450 deg C ...-Minimum Vacuum Level: 100 millitorr (0.13 millibar) ...-Maximum Operating Pressure: 50 psig (4.5 bar) ...-Heated Area: 5.0 x 4.0 in (125 x 100 mm) ...-Recommended process area: 3.5 x 3.5 in (90 x 90 mm) ...-Thermal uniformity process area: 5 deg C or better ...-Maximum heating rate in vacuum: 4℃/sec ...-Typical forced cooling rate: 2 deg C/sec ...-Clearance over hot plate: 2 in (50 mm) ...-Viewing window: 3.5 in (90 mm) diameter ...-Size:(W x D x H): 30.5 x 25 x 19 in (78 x 64 x 48 cm) ...Weight: 180 lb (80 kg) ...-Electrical: 3.0 kW maximum, 50 or 60 Hz 110volt, 15 amp, single phase...-Vacuum: External pump required (not incluced)...-Process gasses: Nitrogen plus one optional at 75 psig (3.5 kg/cm2) (see formic acid option)...-Cooling Water (Optional): 1 gpm at 30 psig (4 lpm at 2 kg/cm^2) ...